Microelectronics Failure Analysis Desk Reference

This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips. Topic coverage includes: Failure Analysis Process Flow, Failure Verification, Failure Modes and Failure Classification, Special Devices (MEMS, Optoelectronics, Passives, Fault Localization Techniques: Package Level (NDT), Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods, Deprocessing & Imaging Techniques: Deprocessing, General Imaging Techniques, Local Deprocessing & Imaging, Circuit Edit and Design Modification, Material Analysis Techniques, Reference Information: Important Topics for Semiconductor Devices, Failure Analysis Techniques Roadmap, Failure Analysis Operations and Management, Appendices: Failure Analysis Terms, Definitions, and Acronyms, Industry Standards