ISTFA 2001 Proceedings of the 27th International Symposium for Testing and Failure Analysis

Proceedings of the 27th International Symposium for Testing and Failure Analysis, 11-15 November 2001, Santa Clara, California.
This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis.
The CD-ROM provides the complete content of the book in searchable Adobe Acrobat PDF format.
Contents include:
Advanced techniques Packaging Backside analysis Scanning probe microscopy Focused ion beam (FIB) techniques Failure analysis of micro-electromechanical systems (MEMS) Yield improvement Discretes Defect-based testing Case histories