Lead-Free Solders: Materials Reliability for Electronics

Content:
Chapter 1 Reliability of Lead?Free Electronic Solder Interconnects: Roles of Material and Service Parameters (pages 1–9): K. N. Subramanian
Chapter 2 Phase Diagrams and Their Applications in Pb?Free Soldering (pages 11–44): Sinn?Wen Chen, Wojciech Gierlotka, Hsin?Jay Wu and Shih?Kang Lin
Chapter 3 Phase Diagrams and Alloy Development (pages 45–70): Alan Dinsdale, Andy Watson, Ales Kroupa, Jan Vrestal, Adela Zemanova and Pavel Broz
Chapter 4 Interaction of Sn?Based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry (pages 71–118): Clemens Schmetterer, Rajesh Ganesan and Herbert Ipser
Chapter 5 ‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb?Free Solders and Joints’ (pages 119–159): Sung K. Kang
Chapter 6 Development and Characterization of Nano?Composite Solder (pages 161–177): Johan Liu, Si Chen and Lilei Ye
Chapter 7 Chemical Changes for Lead?Free Soldering and Their Effect on Reliability (pages 179–194): Laura J. Turbini
Chapter 8 Influence of Microstructure on Creep and High Strain Rate Fracture of Sn?Ag?Based Solder Joints (pages 195–231): P. Kumar, Z. Huang, I. Dutta, G. Subbarayan and R. Mahajan
Chapter 9 Microstructure and Thermomechanical Behavior Pb?Free Solders (pages 233–250): D. R. Frear
Chapter 10 Electromechanical Coupling in Sn?Rich Solder Interconnects (pages 251–271): Q. S. Zhu, H. Y. Liu, L. Zhang, Q. L. Zeng, Z. G. Wang and J. K. Shang
Chapter 11 Effect of Temperature?Dependent Deformation Characteristics on Thermomechanical Fatigue Reliability of Eutectic Sn?Ag Solder Joints (pages 273–295): Andre Lee, Deep Choudhuri and K. N. Subramanian
Chapter 12 Sn Whiskers: Causes, Mechanisms and Mitigation Strategies (pages 297–321): Nitin Jadhav and Eric Chason
Chapter 13 Tin Whiskers (pages 323–335): Katsuaki Suganuma
Chapter 14 Electromigration Reliability of Pb?Free Solder Joints (pages 337–373): Seung?Hyun Chae, Yiwei Wang and Paul S. Ho
Chapter 15 Electromigration in Pb?Free Solder Joints in Electronic Packaging (pages 375–399): Chih Chen, Shih?Wei Liang, Yuan?Wei Chang, Hsiang?Yao Hsiao, Jung Kyu Han and K. N. Tu
Chapter 16 Effects of Electromigration on Electronic Solder Joints (pages 401–422): Sinn?Wen Chen, Chih?Ming Chen, Chao?Hong Wang and Chia?Ming Hsu
Chapter 17 Thermomigration in SnPb and Pb?Free Flip?Chip Solder Joints (pages 423–442): Tian Tian, K. N. Tu, Hsiao?Yun Chen, Hsiang?Yao Hsiao and Chih Chen
Chapter 18 Influence of Miniaturization on Mechanical Reliability of Lead?Free Solder Interconnects (pages 443–485): Golta Khatibi, Herbert Ipser, Martin Lederer and Brigitte Weiss